3M Electrically Conductive Thermosetting Film 2201P

3M Products & Supplies

3M Electrically Conductive Thermosetting Film 2201P, 360 mm x 100 m, 2 Rolls/Case

Name: 3M Electrically Conductive Thermosetting Film 2201P, 360 mm x 100 m, 2 Rolls/Case
Brand: 3M Products & Supplies
SKU: 7010296643
Price: 9443.01 USD
Availability: InStock

Sold As: 2-Pack

SKU: 7010296643

MPN: 7010296643

Lead Time: 43 working days.

UPC: 00048011652054

3M ID: 70071545845

5 Digit UPC: 65205

Shelf Life: 365 Days

Country of Origin: USA

Manufacturer: 3M

Size: 14.1732 in

Color: Green

$9,443.01 ($4721.51 / Count)

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Product Description

3M Electrically Conductive Thermosetting Film (C-TSF) 2201P is an XYZ-axis electrically conductive thermosetting film. This double-sided film has a nickel/copper-coated conductive nonwoven carrier. Designed for EMI shielding and grounding applications, enabling devices to meet electromagnetic compatibility requirements.

3M Electrically Conductive Thermosetting Film 2201P typically has the highest electrical conductivity, adhesion, and overall performance of conductive pressure sensitive adhesive (CPSA) products due to the thermoset resin. The excellent conductivity makes it ideal for small contact areas. This tape requires a modest thermal bonding process under pressure and special storage conditions. This tape provides robust protection against EMI in a range of market segments such as consumer electronics, automotive, medical devices, communication infrastructure, and aerospace & defense electronics.

Recommended Applications:
PCB/flex/chassis grounding
Bond line gap shielding
Electrostatic discharge (ESD)
EMI shield & gasket attachment
Passive intermodulation (PIM) management

From simple to complex designs, our family of shielding and grounding solutions provides protection against EMI. Our solutions provide excellent adhesion to a variety of substrates including metals and plastics. These tapes are easy to apply using low pressure without heat, enhancing productivity. We have multiple thicknesses available to meet even the most space constrained and complex design requirements.