3M Wafer De-Taping Tape 3305 and 879
3M Wafer De-Taping Tape 3305 and 879
3M Wafer De-Taping Tape 3305 and 879
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3M Products & Supplies

3M Polyester Delaminating Tape 3305, 50 mm x 100 m PL(20) EXP

Sold As: 120-Pack
SKU: 7010403025
MPN: 7010403025
Lead Time: 43 working days.
UPC: 00051141414744
3M ID: JT200085218
5 Digit UPC: 41474
Country of Origin: Japan
Manufacturer: 3M
Size: 2.16535 in
Color: Transparent
$8,685.73 ($72.38 / Count)
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Product Description  
3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.

Extra Details

  • Enables simple, low-stress, room temperature peeling of 3M Adhesives from thinned silicon wafers after glass carrier debonding
  • Good holding power
  • High instant adhesion to substrate
  • Transparency allows for inspection without tape removal

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