3M Hybrid Diamond Grinding Wheel 6PHN
3M Hybrid Diamond Grinding Wheel 6PHN
3M Hybrid Diamond Grinding Wheel 6PHN
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3M Products & Supplies

3M Polyimide Hybrid Bond CBN Wheels and Tools, 1V1, 4X3/8X1-1/4, X=3/8, V=45 B220 154PL - MMMPBDW41340

SKU: 7010495898
MPN: 7010495898
Made to Order: For a lead time estimate, please send your request to orders@strobelssupply.com
UPC: 00638060001844
3M ID: 65500401768
5 Digit UPC: 184
Country of Origin: USA
Manufacturer: 3M
Size: 4 in
Thickness: 0.375 in
Abrasive Material: Diamond
$471.61 each
Hurry up! Current stock:
Product Description  
Polyimide bond CBN wheels are used for grinding primary and secondary relief angles on cutting tools made of tool steel and high speed steel. This general purpose wheel offers high cut rates, increased form holding, and increased thermal stability during higher temperature grinding operations.

High Quality Relief Grinding
Our 3M CBN Wheel 154PL was designed for high performance primary and secondary relief grinding. This process is used in the production and sharpening of cutting tools. Cutting edges are typically “relieved” to enhance chip clearance. Primary relief involves removing material directly behind the cutting edge. For secondary relief, a slight bevel is ground next to the primary relief.

The Right Wheel for Every Job
3M provides a broad portfolio of superabrasive wheels used for your round tool relief and clearance angle applications. From short runs and re-sharpening to “lights-out” and long production runs, 3M has the wheel design to meet your needs.

Extra Details

  • Arbor holes are made to customer specifications, so you get exactly the size you need
  • Best used for grinding high speed steel, tool steels, and ferrous metals
  • Cubic boron nitride abrasive mineral provides fast cut rates at high temperatures
  • High cut rates for fast stock removal with improved form holding when compared to phenolic resin bonds
  • The polyimide bond system provides improved thermal stability during high temperature grinding operations when compared to phenolic resin bonds

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