On 3M Vitrified Grinding Wheel 22VD, the surface of the grain/bond compound is improved using self-organizing nano surface structures that practically eliminates cold bonding of the chips and other types of clogging.
On 3M Vitrified Grinding Wheel 22VD, the surface of the grain/bond compound is improved using self-organizing nano surface structures that practically eliminates cold bonding of the chips and other...
On 3M Vitrified Grinding Wheel 22VD, the surface of the grain/bond compound is improved using self-organizing nano surface structures that practically eliminates cold bonding of the chips and other...
On 3M Vitrified Grinding Wheel 22VD, the surface of the grain/bond compound is improved using self-organizing nano surface structures that practically eliminates cold bonding of the chips and other...
On 3M Vitrified Grinding Wheel 22VD, the surface of the grain/bond compound is improved using self-organizing nano surface structures that practically eliminates cold bonding of the chips and other...
On 3M Vitrified Grinding Wheel 22VD, the surface of the grain/bond compound is improved using self-organizing nano surface structures that practically eliminates cold bonding of the chips and other...