3M Wafer De-Taping Tape 3305 and 879
3M Wafer De-Taping Tape 3305, 25 mm x 100 m
3M Wafer De-Taping Tape 3305, 25 mm x 100 m
3M Wafer De-Taping Tape 3305 and 879
3M Wafer De-Taping Tape 3305, 25 mm x 100 m
3M Wafer De-Taping Tape 3305, 25 mm x 100 m
3M Wafer De-Taping Tape 3305 and 879
3M Wafer De-Taping Tape 3305, 25 mm x 100 m
3M Wafer De-Taping Tape 3305, 25 mm x 100 m
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3M Products & Supplies

3M Wafer De-Taping Tape 3305, 25 mm x 100 m

Sold As: 40-Pack
SKU: 7010321285
MPN: 7010321285
Lead Time: 86 working days.
UPC: 04548623422213
3M ID: JT200085234
5 Digit UPC: 42221
Shelf Life: 365 Days
Country of Origin: Japan
Manufacturer: 3M
Size: 0.984252 in
Color: Green
$1,447.62 ($36.19 / Count)
Hurry up! Current stock:
Product Description  
3M Wafer De-Taping Tape 3305 is a transparent polyester film with an adhesive specifically designed for the removal of the 3M WSS adhesive from the surface of the device wafer after the carrier glass is separated from the silicon wafer.A transparent polyester film tape with an agressive rubber adhesive specifically designed for the removal of silicon wafer backgrinding tape.

Extra Details

  • Enables simple, low-stress, room temperature peeling of 3M Adhesives from thinned silicon wafers after glass carrier debonding
  • Good holding power
  • High instant adhesion to substrate
  • Transparency allows for inspection without tape removal

Data Sheet

  1. Tech Data Sheet

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